Room temperature cured epoxy resin NER-814
- Regular price
- ¥8,800 (tax included)
- Selling price
- ¥8,800
- Regular price
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- unit price
- /Per (tax included)
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商品説明
Embedding resin for embedding for SEM cross-section observation
・ Room temperature curing
The main agent and the curing agent are mixed at a ratio of about 3:1 and left at room temperature (23℃) for 48 hours or more to harden.
・ Small heat of polymerization
Since curing is slow, silicon capsules generate only about 1℃ heat of polymerization.
It cures even in a short time (60℃, 5 hours). In that case, the heat of polymerization is about 10℃.
(When using Silicon Capsule No.0)
* There are two types of main agent depending on the hardness, so you can choose according to the sample and conditions.
* Has the same characteristics as conventional epoxy-embedded resin (good adhesive performance, less resin shrinkage).
* It can be used mainly for embedding and specimen preparation for SEM cross-section observation.
・ Mixing ratio (when making 10 ml) * Common to medium and hard
Main agent 8.23g:Hardener 2.7g
・ Curing conditions
All embedded capsules at room temperature (23℃) for at least 48 hours or at 60℃ for 5 hours
* Degas if necessary after stirring.
·set content
Main agent (medium or hard) 500g 1 bottle
Hardener 200g 1 bottle
Applicable regulations
Fire Service Act:Dangerous Goods Class 4