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SEM image collection
Cross-section SEM observation with cryo dry 25°
Cross-section SEM observation is possible easily and quickly by cross-sectioning using an ultramicrotome and a diamond knife.
■Printed circuit board solder joint interfaceObservation conditions Acceleration voltage 1.4kV filtering grid bias voltage 1.1kV | |
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Appearance of printed circuit board and sample cut for cross-sectioning |
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Low acceleration high resolution BSE image 1 Places with relatively good adhesion |
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Low acceleration high resolution BSE image 2 The area where the solder joint interface is in close contact with the peeled area (left side) (right side) |
■Unstained SEM image of PA / ABSObservation conditions Acceleration voltage 0.4kV filtering grid bias voltage 0.35kV | |
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Low acceleration SEM image of PA / ABS cross section |
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Low acceleration and high resolution in-lens SE image Salami structure can be observed even without staining |
■Galvanized steel sheetObservation conditions Acceleration voltage 1.3kV filtering grid bias voltage 1.1kV | |
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■Lead frame | |
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■Ball grid array | |
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■Inkjet paper |
■Painted steel plate |
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Provided by Keio University Kenichi Shimizu | |
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