EPOTEX JP

Epoxy resin that cures at room temperature and does not contain toxic or poisonous substances.

■ Intended Use

It is used for edge observation, appearance inspection, and embedding products that are sensitive to heat.

■ Features

Because of its low shrinkage, gaps are less likely to form between the resin and the material, resulting in high adhesion.

■ Basic Specifications

Product Name: Normal

Curing temperature: Around 40°C

Features: This resin provides the highest adhesion to the sample over time. It also has excellent bubble release even without a degassing agent.

Curing time: 16 hours at 25°C

Hardness: Shore D 82

Product Name: Quick

Curing temperature: Around 55°C

Features: Recommended for those who want a faster cure than the normal version, but due to its slightly higher viscosity, please use a defoamer if you are concerned about bubbles.

Curing time: 8 hours at 25°C

Hardness: Shore D 85

*Applies to both Normal and Quick modes.

Color after curing: Transparent

Mixing ratio: Main agent: Hardener = 2:1

*Please note that both the normal curing agent and the quick curing agent use the same "EPOTEX JP Main Agent" as the base component.

*The curing temperature is a guideline based on the amount of resin used with a φ30mm mold.