FIB grid (special)

〇 There is an L-type one-ear type and a U-type binaural type.があります。

〇 There are 1-stage type with the same grid and the same thickness on the entire surface and 2-stage type with the thin section sample support part processed into a thin plate. The 2-stage type is handled because the thickness of the part that handles the grid is thicker than the 1-stage type. Is easyです。

■LF1 type FIB grid

・One-ear type grid with flat sample support。
・The board thickness is the same on all sides。
・Letters and round hole penetration processing or etching engravingす。
・Materials Cu30μmt Mo20µmt Ni20μmt are availableを取り揃えています。

■LF2 type FIB grid

・A one-ear type grid with a flat sample support that has been processed into a thin plate.。
・Thin plate processing area 1.2 mm W0.2 mm D Thin plate thickness 1525 μm～25μm
・Character round hole penetration processing or etching engravingます。
・Material：We have Cu50μmt Ti 50μmt Mo30μmt取り揃えています。

■UF1 type FIB grid

・A binaural grid with a flat sample support。
・The board thickness is the same on all sides。
・Letters and round hole penetration processing or etching engravingす。
・Material：We have Cu30μmt Mo20μmtえています。

■UF2 type FIB grid

・A binaural type grid with a flat sample support that has been processed into a thin plate.。
・Thin plate processing area 1.2 mm W0.2 mm D Thin plate thickness 1525 μm～25μm
・Character round hole penetration processing or etching engravingます。
・Material：We have Cu50μmt Ti 50μmt Mo30μmt取り揃えています。

■UF3 type FIB grid

・A binaural grid with a flat sample support。
・A type in which the thin section sample loading position is shifted 0.30.4 mm above the vertical center of 3 mmΦ.プ。
・The board thickness is the same on all sides。
・Letters and round hole penetration processing or etching engravingす。
・Material：We have Cu30μmt Mo20μmtえています。

■UF5 type FIB grid

・A binaural (short-eared) type grid with a flat sample support.。
・A type in which the sample thin section loading position coincides with the vertical center of 3 mmΦ。
・The board thickness is the same on all sides。
・Letters and round hole penetration processing or etching engravingす。
・Material：Cu 30 μmt Ti 20 μmt Ni 20 μmt Mo 20 μmt is availablet）を取り揃えています。

※The characters and symbols shown in the product image schematic are subject to change without notice due to product improvements, etc.ります。

※Please refer to the list below and specify the product when making an order inquiry.さい。

〇 Product list